2025年DDC技术白皮书

DDC 技术白皮书 Copyright © 2025 新华三技术有限公司 版权所有，保留一切权利。 非经本公司书面许可，任何单位和个人不得擅自摘抄、复制本文档内容的部分或全部，并不得以任何形式传播。 除新华三技术有限公司的商标外，本手册中出现的其它公司的商标、产品标识及商品名称，由各自权利人拥有。 本文中的内容为通用性技术信息，某些信息可能不适用于您所购买的产品。 i 目 录 1 概述 ······························································································································· 1 1.1 产生背景······················································································································ 1 1.1.1 传统交换机的限制 ································································································· 1 1.1.2 DDC 技术 ············································································································ 1 1.2 技术优势······················································································································ 2 2 DDC 技术实现 ·················································································································· 3 2.1 DDC 物理架构 ·············································································································· 3 2.1.1 DDC 物理设备概述 ································································································ 3 2.1.2 DDC 的设备连接要求 ····························································································· 4 2.2 DDC 的数据转发机制 ····································································································· 4 2.2.1 概述 ··················································································································· 4 2.2.2 技术优势 ············································································································· 5 2.2.3 数据转发表项的生成和同步 ····················································································· 6 2.2.4 基于信元（Cell）的转发 ························································································· 8 2.2.5 基于 VOQ 的拥塞控制 ···························································································· 9 2.2.6 Cell 网络数据转发流程 ························································································· 10 3 H3C 实现的技术特色 ······································································································· 11 3.1 去中心化···················································································································· 11 3.2 开放性 ······················································································································ 12 4 DDC 在人工智能数据中心（AIDC）中的典型组网应用 ··························································· 13 1 1 概述 1.1 产生背景 1.1.1 传统交换机的限制 随着大数据、云计算和人工智能技术的快速发展，数据中心遭遇了流量激增的挑战。如何快速处理这些流量，给数据中心的核心交换机带来了巨大的压力。 数据中心的核心交换机均为传统框式交换机。传统框式交换机通常是封闭式的、集中式的大型机箱（Chassis），就像一个“大铁柜”。其中所有的组件如主控引擎、交换板、接口板等都集中在一个柜子里。这种设计虽然集中且易于管理，但存在以下局限性： • 扩展性困境 传统机框式交换机端口密度受限于机框槽位数量，一旦槽位用尽就必须整机更换或购买新机。 • 能效挑战 传统的大型框式交换机在交换芯片技术不断进步、交换容量不断增大（从 100G 迈向 400G）的同时，也带来了功耗的显著提升。一个 16 槽位、全 400G 端口的框式交换机可能需要高达 4 到 5 万