5G数字世界 — 建于芯片之上(英文)

Brought to you by Informa Tech 10 Nov 2020 5G Digital World —Built on Chips 01 © 2020 Omdia. All rights reserved. Unauthorized reproduction prohibited. Contents 1. Abstract 2 2. An Interconnected World Driven by IoT and Communication 3 2.1. Communication Technologies Extend the Scale of the Interconnected World 3 2.2. IoT and Chips Lay the Foundation of the Interconnected World 5 3. 5G+AI Establish the Foundation of Application Scenarios 7 3.1. 5G+AI in Smartphones 7 3.2. 5G + AI in Other Scenarios 9 4. Discover the New Commercial Value of IoT 11 4.1. 5G Network Upgrades and Catalyzes a New Generation of Application Scenarios 11 4.2. Consumer Market Application Scenarios 14 4.3. Industrial/Corporate/Municipal Application Scenarios 15 4.4. Automotive Application Scenarios 17 5. Chips in Vertical Industry Scenarios 22 5.1. 5G Chips in Consumer Application Scenarios 22 5.2. 5G Chips in Industrial Application Scenarios 24 5.3. 5G Chips in Automotive Application Scenarios 28 6. 5G Chip Competition Landscape in the IoT World 30 6.1. Competition and Role of Chip Manufacturers in the 5G Era 30 6.2. The Importance of Full-Range Communication Solutions in the 5G Era 32 7. Conclusion 34 Appendix 36 02 © 2020 Omdia. All rights reserved. Unauthorized reproduction prohibited. 1. Abstract 2020 is certainly an extraordinary year. Governments around the world have been implementing policies to promote 5G technologies and applications, which has plunged operators worldwide into even fiercer competition in large-scale commercial rollout of 5G and trials in vertical industries. The COVID-19 pandemic has not only retarded the rapid development of 5G networks and the interconnected world but has also exerted a profound impact on the usage habits of global consumers. Meanwhile, this also allows us to take time to look into the future of 5G and the interconnected world from a new perspective. In the entire software and hardware ecology and application scenarios, chips are essential to almost all hardware and vertical applications, in which they perform all the key tasks of data collection, flow, storage and processing. The use of chips enables data aggregation, flow, distribution and processing among cloud, channel, edge and terminal, bringing about a digital world which is comprised of cellular network, communication chips, mobile terminals, CPE, wearables and software platforms etc. Such a system allows technologies to co-exist and co-develop, while facilitating the realization of greater commercial value through deep integration and iteration of cutting-edge technologies. On the basis of the industry characteristics, 5G and AI are brought together to work out personal intelligent solutions for the consumer electronics industry, provide support for the industrial system of industrial electronics, make the business world more intelligent, and explore and innovate in the new area of ubiquitous networking. Due to t

立即下载
信息科技
2020-11-23
Omdia
38页
1.9M
收藏
分享

[Omdia]:5G数字世界 — 建于芯片之上(英文),点击即可下载。报告格式为PDF,大小1.9M,页数38页,欢迎下载。

本报告共38页,只提供前10页预览,清晰完整版报告请下载后查看,喜欢就下载吧!
立即下载
本报告共38页,只提供前10页预览,清晰完整版报告请下载后查看,喜欢就下载吧!
立即下载
水滴研报所有报告均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
相关图表
表 12 2020 年三季度资产支持证券信用等级对利差影响的显著性检验
信息科技
2020-11-23
来源:2020年三季度资产支持证券市场季报:首单5G专场资产证券化产品成功发行,基础设施公募REITs试点加速推进-联合资信
查看原文
表 11 2020 年三季度资产支持证券发行利差统计表(交易所市场)
信息科技
2020-11-23
来源:2020年三季度资产支持证券市场季报:首单5G专场资产证券化产品成功发行,基础设施公募REITs试点加速推进-联合资信
查看原文
表 10 2020 年三季度资产支持证券发行利差统计表(银行间市场)
信息科技
2020-11-23
来源:2020年三季度资产支持证券市场季报:首单5G专场资产证券化产品成功发行,基础设施公募REITs试点加速推进-联合资信
查看原文
表 9 2020 年三季度资产支持证券发行利差统计表(全市场)
信息科技
2020-11-23
来源:2020年三季度资产支持证券市场季报:首单5G专场资产证券化产品成功发行,基础设施公募REITs试点加速推进-联合资信
查看原文
表 8 2020 年三季度资产支持证券级别调降统计表
信息科技
2020-11-23
来源:2020年三季度资产支持证券市场季报:首单5G专场资产证券化产品成功发行,基础设施公募REITs试点加速推进-联合资信
查看原文
表 7 截至 2020 年三季度末存续资产支持证券信用等级统计表
信息科技
2020-11-23
来源:2020年三季度资产支持证券市场季报:首单5G专场资产证券化产品成功发行,基础设施公募REITs试点加速推进-联合资信
查看原文
回顶部
报告群
公众号
小程序
在线客服
收起